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Memory Big-3 Terminal

Samsung · SK hynix · Micron — DRAM & NAND $/GB · contract price · HBM · capex
LIVE
Haelangdal Research · RAMpocalypse

Memory Big-3 TrackerDRAM & NAND · Samsung · SK hynix · Micron

LIVE
Data 2026-07-20
Earnings: 2Q26 prelim (Samsung, Jul 7) · 1Q26 (SK) / FQ3’26 (Micron)
Detail
Samsung005930
₩261,500+1.75%
Mkt Cap
~₩1,546T
2Q26 Rev (prelim)
₩171T
Op. Income (prelim)
₩89.4T
12M FWD PER
≈9x
Detail
SK hynix000660
₩1,688,000+0.60%
Mkt Cap
~₩1,232T
1Q26 Rev
₩52.58T
Op. Income
₩37.61T
12M FWD PER
≈9x
Detail
MicronMU
$932.97+2.48%
Mkt Cap
~$1.05T
FQ3 Rev
$41.46B
Op. Income
$33.7B
12M FWD PER
≈10x
Deep track

Toggle DRAM and NAND to read $/GB history, revenue, cycle position and the high-margin frontier symmetrically across both axes.

AStructure — 40 years of DRAM price

Long-run price per GB. Switch period and scale to explore.

Detail

DRAM price/GB (1980→2026, log) — first rebound after a 7,000× fall

USD per GB · nominal lowest retail

Period
Scale
$1$10$100$1K$10K$100K$1M$10M'80'88'96'04'12'2026 Q1
DRAM $/GB (nominal, McCallum-derived)
From $6.6M per GB to $1.84 in 2023 — a fall of over 7,000×. The decline already bent from −36%/yr to −15%/yr after 2010, and for the first time since the 2023 bottom the direction turned up. Not the end of structural deflation, but a cycle reversal.
BWhy this cycle is different

Price shock vs past down-cycles, and inventory dried out.

Detail

Cycle shock comparison (DRAM price, %)

-100-500501001501995→97supercycle2000→01dot-com2008 GFC2018→19down2022→23crash2023→26rebound
The past five down-cycles were price collapses of −48~−84%. This time it runs the other way — +170% off the bottom. The first cycle pointing up.
Detail

Maker inventory days (DIO) — from filings, lower is tighter

050100150200normal ~120d2023 glutpeakSamsung*MicronSK hynix
Maker inventory days have fallen from the 2023 glut peak (Micron 182, SK hynix ~200) to Micron 120 days, SK hynix ~125 and Samsung ~95 — broadly at the ~120-day norm. The glut has cleared and inventories have normalized. (Samsung is company-level, DS not split out.)
Play cycle2Q264/4
3Q254Q251Q262Q26

Hit ▶ or drag the handle — the revenue, OPM and contract-price charts unfold up to that quarter, the RAMpocalypse cycle playing out before your eyes.

1Quarterly revenue trend

Converted to KRW trillion (USD 1,480) · Micron fiscal quarter · Samsung is the DS (semiconductor) division

Detail
Samsung DSSKMicron (FQ)
0T30T60T90T3Q254Q251Q262Q26
Revenue scaled up vertically in one year — Samsung DS 33→82T, SK 25→53T, Micron 17→61T. The AI-memory price surge pulled all three at once.
2Quarterly operating margin

Quarterly OPM (%)

Detail
Samsung DSSKMicron (FQ)
0%25%50%75%100%3Q254Q251Q262Q26
SK 72%, Micron 81%, Samsung DS ~66% — memory repricing flows straight into margins. A structurally high-margin phase where cycle margins now exceed prior peaks.
3DRAM · NAND revenue

TrendForce quarterly revenue (USD bn)

Detail

DRAM revenue · 4Q25 → 1Q26

SamsungSKMicron
0102030404Q251Q26
Detail

NAND revenue · 1Q26 (vendor)

0481216SamsungSK groupKioxiaMicron
DRAM scale stays Samsung > SK > Micron; 1Q26 price spikes lifted all of them. NAND ranks Samsung · SK group (+Solidigm) · Kioxia — Samsung is #1 by scale.
4Memory contract prices — the cycle driver

TrendForce contract-price QoQ change (%)

Detail
DRAMNAND
0%25%50%75%100%1Q262Q26
DRAM contract prices jumped +90~95% in 1Q26 (a record), then +58~63% in 2Q, while NAND accelerated +55~60% → +70~75%, overtaking DRAM for the first time this cycle. The 3Q26 outlook is DRAM +13~18% · NAND +10~15% — the rise runs a third quarter, but the slope bends. The server-DRAM increase lands mostly on non-LTA volume; multi-year LTAs cap prices for contracted U.S. CSPs.
4bSpot & Contract Prices

Spot = free TrendForce · memorymarket snapshots · Contract = %QoQ move log (not absolute levels) · $/kg = customs ASP proxy · HBM has no spot market

Detail

Spot timeseries — chip price vs module price

Chip spot ($/chip · $/Gb)

Item · specSeriesLatest
DDR5 16Gb (4800/5600)16Gb chip · 4800~5600 Mbps · TrendForce dram_spotaccruing · 1 pts$50.07$/chiphi $65.0 / lo $32.5
DDR4 16Gb 320016Gb chip · 3200 Mbps · TrendForce dram_spotaccruing · 1 pts$81.20$/chip—
DDR4 8Gb 32008Gb chip · 3200 Mbps · TrendForce dram_spotaccruing · 1 pts$41.10$/chip—
NAND 512Gb TLC wafer512Gb TLC wafer · TrendForce flash_spotaccruing · 1 pts$17.65$/chiphi $19.8 / lo $15.5
DDR4 16Gb (cross-check)16Gb chip · memorymarket.comaccruing · 1 pts$50.00$/chip—
NAND 1Tb TLC (cross-check)1Tb TLC · memorymarket.comaccruing · 1 pts$29.00$/chip—

Module spot ($/module · $/drive)

Item · specSeriesLatest
DDR5 UDIMM 16GB-5600 (module)16GB UDIMM · 5600 · memorymarket.comaccruing · 1 pts$159.00$/module—
Channel SSD 1TB PCIe4 (module)1TB PCIe4 SSD · memorymarket.comaccruing · 1 pts$130.00$/drive—
Chip price ($/chip·$/Gb) and module price ($/module) use different units and are not directly comparable — separated by label.
Spec-level spot history is not in free sources — we accumulate it from now on. For the long-run $/GB trend, see the [DRAM/NAND long-run price] section above.
Detail

Contract event log — %QoQ moves (not absolute levels)

2026-07-09Server DRAM+13~18%3Q26E

Increase lands mostly on non-LTA volume; multi-year LTAs cap prices for contracted U.S. CSPs. LTA cap released Jul 9, 2026.

TrendForce 무료 보도자료 (2026-07-03·07-09)
2026-07-03NAND+10~15%3Q26E

3Q26 outlook — the rise runs a third quarter, but the slope bends.

TrendForce 무료 보도자료 (2026-07-03)
2026-04-01DRAM+58~63%2Q26

The quarter after the 1Q26 +90~95% record — DRAM contract prices surged for a second quarter.

TrendForce 무료 보도자료 (2026-04)
Detail

Customs $/kg timeseries — Korean-3 ASP proxy

DRAM (excl. modules)관세청 7/1~20 · 2026-07-20accruing · 1 pts$100,198/kg+22% MoM
NAND관세청 7/1~20 · 2026-07-20accruing · 1 pts$56,808/kg-22% MoM
MCP (HBM)관세청 7/1~20 · 2026-07-20accruing · 1 pts$88,580/kg-8% MoM
SSD관세청 7/1~20 · 2026-07-20accruing · 1 pts$21,038/kg-1% MoM
* The customs $/kg is a Korean-3 export ASP proxy. The product taxonomy cannot decompose by spec (speed/capacity/generation), and HBM is mixed into the MCP (multi-chip IC) line — MCP≈HBM is an approximation.
Detail
HBM has no spot marketN/A

HBM is supplied entirely via contract and custom allocation, so no spot market exists. We proxy it with the customs MCP $/kg and TrendForce HBM3E contract trends.

HBM3E/HBM4 contract prices hold a premium over commodity DRAM; most 2026 volume is pre-booked.
Source. TrendForce dram_spot / flash_spot (무료 현물 스냅샷) · memorymarket.com (무료 현물 교차검증) · TrendForce 무료 보도자료 (계약가 %QoQ 이동 로그) · 관세청 품목별 무역통계 7/1~20 (한국-3사 ASP proxy)
Spot prices are free TrendForce / memorymarket snapshots entered manually (no automatic scraping). Contract data is a %-move log, not absolute levels (absolute levels are paid). The $/kg figures are a customs ASP proxy and cannot be decomposed by spec. HBM has no spot market. For data tracking only — not investment advice.
CDRAM’s AI frontier — HBM

HBM share, market size, and device price pass-through.

Detail

HBM share of Micron DRAM revenue (%) — 3× in two years

0102030405020232025
Detail

DRAM market size ($B) — 25% of all chips by 2026E

05010015020020252026E
Detail

Device price pass-through (memory cost cited, $ midpoint)

0100200300Apple Mac/iPad$100~300Dell PC32GB configXbox consolefrom Aug 1
Higher memory prices flow into finished-device prices — Apple, Dell and Xbox all raised prices on 6/25 citing memory costs. As makers reclaim pricing power, downstream passes it to consumers.
5HBM · Capex · supply

AI-memory competition · capex investment by cycle · shortage persists

Detail

HBM4 competition

SK hynixHBM4 leader
~70%
SamsungHBM4 mass shipment · share recovery
Recovery
MicronHBM4 rev $1B+, 12-hi ramp
Expanding

2026 Capex (USD bn)

081624SKSamsungMicron
Detail

Supply — structural shortage

Shortage persistsshortage runway
~late 2027 · 2028
New fab meaningful outputmeaningful output
Unlikely before 2028
2026 supply growthIDC · DRAM/NAND
+16% / +17%
SK 2027 demandPre-booked, supply gap widens
Booked
Three-firm 26E combined Op. incomeThis report’s estimate
~$480B
All three concentrate capacity on HBM and servers → commodity/legacy supply stays constrained. An excess-demand structure where 2027 demand is already pre-booked.
Memory Plus
PREVIEW

Ported from local jarvis-bridge research — segment/channel breakdown, price overlay, CXMT listing tracker.

Detail
Memory Big-3 Operating Profit — Rebuilt From the Bottom UpPREVIEW

forward P/E 분모 — 사업부별·지불채널별 분해

Samsung DS005930 · 1Q26
Revenue (Q)
82T KRW
OPM
66%
Op. profit (Q)
54.1T KRW
Annualized
216T KRW

Revenue mix (by unit)

DRAM 54%HBM 7%NAND 22%Other 16%
SK hynix000660 · 1Q26
Revenue (Q)
52.6T KRW
OPM
72%
Op. profit (Q)
37.9T KRW
Annualized
152T KRW

Revenue mix (by unit)

DRAM 51%HBM 21%NAND 19%Other 9%
MicronMU · FQ3'26
⚠ quarter offset
Revenue (Q)
61.4T KRW
OPM
81%
Op. profit (Q)
49.7T KRW
Annualized
199T KRW

Revenue mix (by unit)

DRAM 43%HBM 5%NAND 13%Other 39%

Calendar-vs-fiscal-quarter timing gap (total revenue = FQ3, DRAM = calendar Q1)

Quarter-offset warning — Samsung and SK use calendar 1Q26 (Jan-Mar); Micron uses fiscal FQ3'26 (Mar-May), one quarter later. With the market growing ~60% per quarter, matching the same calendar quarter puts SK hynix ahead of Micron in revenue ($39B vs ~$30B for Jan-Mar). Micron looking larger is a quarter-lag artifact, not a ranking. HBM share: SK 55%+ vs Micron 15%. Much of the 80% vs 72% margin gap is this same timing effect.

4 payment channels — who ultimately pays

Hyperscaler direct purchase증분은 회사채 의존 ($121B 발행, 5년평균 4.3배)
$220B
HBM routed through NVIDIASingle gatekeeper (NVIDIA). SK hynix has secured 2/3 of Rubin HBM4 volume
$60B
Stargate (new)지불원천 = 오라클 차입(부채율 500%)·오픈AI 연 -$14B
$70B
Devices & consumersAdjusts on volume — if pass-through hurts sell-through, memory content per device shrinks
$170B
jarvis-bridge memory_op.json — company IR/8-K quarterly revenue & OPM, TrendForce DRAM/NAND revenue
Detail
Memory Big-3 · Price Overlay (USD-converted)PREVIEW

2026-08-07 장중저점 기준 — 게이트는 3사 공통 최신 거래일 자동 산출. KR 명목가는 KRW=X 로 USD 환산해 3사를 같은 통화 축에서 오버레이.

Indexed (100 = 2026-01-02)

96253410삼성전자SK하이닉스마이크론
Range2026-01-02 — 2026-08-07 · 150 pts
Samsung Electronics
vs peak: -31.84% (2026-06-02)
latest: $162.413 (2026-08-07)
SK hynix
vs peak: -47.55% (2026-06-22)
latest: $999.789 (2026-08-07)
Micron
vs peak: -27.68% (2026-06-25)
latest: $877.57 (2026-08-07)
jarvis-bridge memory3_px.json — yfinance daily OHLC (005930.KS, 000660.KS, MU), USD-converted via KRW=X daily close
Detail
CXMT Post-Listing Tracker (长鑫科技 / 长鑫存储)PREVIEW

The listed entity is 长鑫科技集团股份有限公司 (CXMT Corporation), commonly referred to in media as '长鑫存储'. Written pre-listing — postListing fields are filled after 7/27 by cxmt_refresh.py or manually.

Code · exchange
688825.SH · SSE STAR Market (科创板)
Listing date
2026-07-27
Offer price
8.66 CNY
P/E at offer
308.92x
Day-1 float
6.73%
Post-listing (open, turnover)
422.17%
Next lock-up event6-month lock-up expiry. If shares are above the offer price, profit-taking pressure builds — small in size, but the first supply/demand event.
2027-01-27 · 2.27%
jarvis-bridge cxmt_tracker.json — stcn.com / SSE listing filings, yfinance (to be refreshed post-listing)
Source. Each firm’s IR·8-K (rev·OP·OPM, 4Q25~FQ3’26; Samsung 2Q26 prelim on Jul 7) · TrendForce (DRAM/NAND rev·contract prices) · IDC (supply growth) · each firm’s guidance (Capex·HBM). Samsung DS 1Q26 OP/OPM is estimated as the split is not yet disclosed; Samsung 2Q26 is a company-level preliminary print (no segment split). FX USD 1,480 KRW. Maker inventory days (DIO) are from filings — Micron FQ3’26 and SK hynix / Samsung quarterly reports.
A data-tracking tool, not investment advice · as of the labeled date · © Haelangdal Research · newmoneymoves.io
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