Released
FY2026 Q1
Earnings Review403870
HPSP
HPSP Co., Ltd. · 반도체 장비 (고압 어닐링)
Fri, May 15, 2026·After Market Close
HPSPHigh-pressure annealingSemi equipmentEUVHBM4Korea equipment
01Wall Street Consensus
EPS—
Revenue~316억원
02Earnings Results
EPS—
RevenueKRW 31.9B
Operating profitKRW 16.1B
Operating margin50.5%
Revenue YoY-14%
After-Hours Reactionflat
※ EPS not disclosed — preliminary results (standalone revenue / OP basis)
Key Takeaways
- Q1 revenue KRW 31.9B — QoQ -39%, YoY -14%, one-off trough passed
- Operating profit KRW 16.1B — OPM rebounds to 50.5% (+2% vs consensus KRW 15.8B)
- New customer revenue contribution implied — memory diversification signal
- Step-up trajectory from Q2 onwards (Samsung Securities, Korea Investment)
- HBM4 process support + EUV sub-3nm penetration acceleration as H2 drivers
- Full-year 2026 guide KRW 249.7B revenue (+44%) / OP KRW 136.1B (OPM 54.5%) maintained
Key Checkpoints
- 01High-pressure annealing tool shipments — memory + logic
- 02Penetration into new EUV nodes
- 03Whether OPM recovers to mid-50%
- 04FY2026 guidance
- 05Effectively monopolistic global share
Upside Catalysts
- First-half-low / second-half-high pattern — H2 recovery expected
- New orders for HBM4-process tools
- Faster EUV-node penetration (sub-3nm)
Risk Factors
- Q1 revenue expected -14% YoY
- Q1 OP expected to miss consensus KRW 18.9B by ~16% (KRW 15.8B)
- Memory capex timing lag
Detail
SEPS 서프라이즈 히스토리
Beat0Miss1Beat률 0%
분기별 EPS 컨센서스 대비 서프라이즈(%) — 막대: EPS, 점선: 매출
컨센서스 대비 실제 EPS/매출 서프라이즈 (%)