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AI INFRA MAP · RACK BOM · VALUE CHAIN

AI INFRA MAP

NVIDIA rack BOM treemap and the 9-layer AI value chain on one board
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Two AI infrastructure maps under one category. Rack BOM decomposes a single NVIDIA AI server rack by component cost share as a treemap; Value Chain shows the 9 layers of AI infrastructure as a tiered flow. Switch views with the tabs below.

DEMAND — HYPERSCALER 2025 CAPEXBloomberg BQL · 2026-07-10

This is the money that buys the rack. Component demand across the BOM and value chain below starts from these four datacenter budgets.

Amazon

$126B

Alphabet

$91.2B

Meta

$70.6B

Microsoft · FY

$65.9B

COMBINED

$353B

FY2025 capex consensus estimates (USD). Microsoft is fiscal-year based (FY2025, ending Jun 2025); the other three are calendar 2025.

Rack BOMA single rack, part by part — bigger area means bigger cost share. Toggle GB200 vs Vera Rubin.
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$7.8M·Vera Rubin · next-gen (Q3 2026 shipment)

Area = rack BOM cost share · color = subsystem

Compute53%Memory25.6%Networking9.2%Power2%Cooling1%Chassis & substrate5.6%

Source: VR200 NVL72 rack per-component costs from the 'Vera Rubin BOM Revision' report (Morgan Stanley Apr 2026 estimates, reported by Wccftech / Tom's Hardware May 2026). Rack total $7,803,148.

Suppliers by subsystem
Compute (GPU + CPU)
  • NVIDIAREV 4Q$130B+114%~2025.01Rubin GPU design · system integration
  • TSMCREV 4Q$123B+36%~2025.12GPU die foundry
  • NVIDIAREV 4Q$130B+114%~2025.01Vera CPU design
Memory (HBM4 + LPDDR5X)
  • SK HynixREV 4Q$68.3B+41%~2025.12HBM4 #1 (est. ~55% of NVIDIA supply)
  • Samsung ElectronicsREV 4Q$235B+6%~2025.12HBM4 dual supply (est. ~30%)
  • MicronREV 4Q$37.4B+49%~2025.08HBM4 follower (est. ~15%)
  • Samsung ElectronicsREV 4Q$235B+6%~2025.12LPDDR5X SOCAMM2 edge (est. ~50% of NVIDIA)
  • SK HynixREV 4Q$68.3B+41%~2025.12LPDDR5X supply
  • MicronREV 4Q$37.4B+49%~2025.08LPDDR5X supply
Networking (NVLink Switch · optical)
  • CoherentREV 4Q$5.8B+23%~2025.06Optical transceivers · EML chips
  • LumentumREV 4Q$1.6B+21%~2025.06Optical modules · EML
  • Astera LabsREV 4Q$853M+115%~2025.12Connectivity · retimers
  • MarvellREV 4Q$5.8B+5%~2025.02Optical DSP · networking ASIC
Power (PSU · distribution)
  • EatonREV 4Q$27.4B+10%~2025.12Distribution · power infrastructure
  • VertivREV 4Q$10.2B+28%~2025.12Power · UPS
Cooling (liquid · CDU)
  • VertivREV 4Q$10.2B+28%~2025.12Liquid cooling · CDU integration
Chassis · PCB · substrate · passives
  • Isu PetasysREV 4Q$766M+25%~2025.12High-layer PCB specialist
  • Daeduck ElectronicsREV 4Q$750M+15%~2025.12High-layer PCB (attractive on 27F)
  • Samsung Electro-MechanicsREV 4Q$8.0B+5%~2025.12FCBGA substrate (Korea's direct competitor)
  • Samsung Electro-MechanicsREV 4Q$8.0B+5%~2025.12MLCC global #2-3

For informational purposes only; not a solicitation to buy or sell. Treemap area / bubble size reflects BOM cost share or Haelangdal conviction and is unrelated to market capitalization.

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