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AI Infra Maps

AI Infra Maps

Two AI infrastructure maps under one category. Rack BOM decomposes a single NVIDIA AI server rack by component cost share as a treemap; Value Chain shows the 9 layers of AI infrastructure as a tiered flow. Switch views with the tabs below.

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A single rack, part by part — bigger area means bigger cost share. Toggle GB200 vs Vera Rubin.

$7.8M·Vera Rubin · next-gen (Q3 2026 shipment)

Area = rack BOM cost share · color = subsystem

Compute 53%
Memory 25.6%
Networking 9.2%
Power 2%
Cooling 1%
Chassis & substrate 5.6%

Source: VR200 NVL72 rack per-component costs from the 'Vera Rubin BOM Revision' report (Morgan Stanley Apr 2026 estimates, reported by Wccftech / Tom's Hardware May 2026). Rack total $7,803,148.

Suppliers by subsystem

Compute (GPU + CPU)
  • NVIDIARubin GPU design · system integration
  • TSMCGPU die foundry
  • NVIDIAVera CPU design
Memory (HBM4 + LPDDR5X)
  • SK HynixHBM4 #1 (est. ~55% of NVIDIA supply)
  • Samsung ElectronicsHBM4 dual supply (est. ~30%)
  • MicronHBM4 follower (est. ~15%)
  • Samsung ElectronicsLPDDR5X SOCAMM2 edge (est. ~50% of NVIDIA)
  • SK HynixLPDDR5X supply
  • MicronLPDDR5X supply
Networking (NVLink Switch · optical)
  • CoherentOptical transceivers · EML chips
  • LumentumOptical modules · EML
  • Astera LabsConnectivity · retimers
  • MarvellOptical DSP · networking ASIC
Power (PSU · distribution)
  • EatonDistribution · power infrastructure
  • VertivPower · UPS
Cooling (liquid · CDU)
  • VertivLiquid cooling · CDU integration
Chassis · PCB · substrate · passives
  • Isu PetasysHigh-layer PCB specialist
  • Daeduck ElectronicsHigh-layer PCB (attractive on 27F)
  • Samsung Electro-MechanicsFCBGA substrate (Korea's direct competitor)
  • Samsung Electro-MechanicsMLCC global #2-3

For informational purposes only; not a solicitation to buy or sell. Treemap area / bubble size reflects BOM cost share or Haelangdal conviction and is unrelated to market capitalization.

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