매크로 컨텍스트

테마

CPO Packaging & Assembly

핵심 동인

  • 2027 CPO commercialization roadmap
  • Recruiting key talent from TSMC/Intel
  • Foundry + HBM + packaging vertical integration
  • Singapore silicon photonics R&D center

리스크

  • Technology gap vs. TSMC
  • Persistent foundry yield issues
  • CPO R&D investment burden
  • HBM4 qualification delay risk

애널리스트 컨센서스

최저 110,000 KRW최고 340,000 KRW
현재가컨센서스 목표가

2026. 6. 16. 기준

증권사애널리스트목표가투자의견
투자 기간: 12개월

모니터링 트리거

핵심 지표

  • CPO technology development progress
  • Foundry GAA yield
  • HBM4 qualification timeline
  • Silicon photonics R&D investment

리뷰 트리거

  • CPO roadmap delay
  • Key customer exits to TSMC
  • Foundry yield improvement delay

무효화 조건

  • CPO commercialization failure
  • Foundry competitiveness weakens
  • TSMC gap widens

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Comments

생성: 2026. 2. 25.수정: 2026. 2. 25.가격 기준: 2026. 6. 16.