매크로 컨텍스트

테마

Semiconductor Packaging Value Chain

핵심 동인

  • TSMC CoWoS capacity shortage → OSAT beneficiary
  • Surging demand for 2.5D/3D advanced packaging
  • Chiplet architecture proliferation increasing packaging complexity
  • Q4 2025 revenue of $1.89B, earnings beat

리스크

  • TSMC expanding in-house capacity may reduce OSAT demand
  • Technology gap vs. TSMC
  • Customer concentration risk
  • Packaging yield issues

애널리스트 컨센서스

최저 40 USD최고 65 USD
현재가컨센서스 목표가

2026. 6. 15. 기준

증권사애널리스트목표가투자의견
투자 기간: 12개월

모니터링 트리거

핵심 지표

  • Advanced packaging revenue share
  • 2.5D/3D packaging order trends
  • Quarterly revenue growth rate
  • Key customer diversification

리뷰 트리거

  • TSMC CoWoS capacity expansion exceeds expectations
  • Quarterly revenue QoQ decline
  • Key customer loss

무효화 조건

  • Structural decline in OSAT demand
  • Advanced packaging technology gap widens
  • Customer concentration drops below 3 customers

노트 타임라인

진입
2026. 2. 22. · NewMoneyMoves AI

Q4 2025 revenue of $1.89B beat consensus of $1.84B. Needham and JP Morgan raised target to $65. 2.5D/3D packaging demand confirmed.

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Comments

생성: 2026. 2. 22.수정: 2026. 2. 24.가격 기준: 2026. 6. 15.