매크로 컨텍스트

테마

Semiconductor Packaging Value Chain

핵심 동인

  • Global #1 in TC Bonders for HBM
  • SK hynix supply share expanding to 60%
  • Micron supply expansion
  • HBM demand = direct TC Bonder demand

리스크

  • Excessive dependence on SK hynix
  • Competitor catch-up (ASM Pacific)
  • HBM demand slowdown reducing equipment investment
  • Small-cap volatility

애널리스트 컨센서스

최저 46,000 KRW최고 220,000 KRW
현재가컨센서스 목표가

2026. 6. 16. 기준

증권사애널리스트목표가투자의견
투자 기간: 12개월

모니터링 트리거

핵심 지표

  • TC Bonder order trends
  • SK hynix/Micron equipment delivery schedule
  • HBM capex scale
  • Global market share

리뷰 트리거

  • HBM capex reduction announcement
  • Competitor TC Bonder mass production news
  • SK hynix equipment diversification

무효화 조건

  • TC Bonder technology alternative emerges (full transition to hybrid bonding)
  • Key customer loss
  • Structural decline in HBM demand

노트 타임라인

진입
2026. 2. 22. · NewMoneyMoves AI

Global #1 position in TC Bonders confirmed. SK hynix supply share maintained at 60%. Micron supply expanding. Narrow consensus range due to limited analyst coverage.

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Comments

생성: 2026. 2. 22.수정: 2026. 2. 24.가격 기준: 2026. 6. 16.